Title
Planarization of a CMOS die for an integrated metal MEMS
Document Type
Conference Proceeding
Event
Proceedings of SPIE: Micromachining and Microfabrication Process Technology VIII
Recommended Citation
Lee, H.; Miller, M. H.; and Bifano, T. G., "Planarization of a CMOS die for an integrated metal MEMS" (2019). Engineering, School of . 275.
https://cufind.campbell.edu/engineering/275
COinS
