Title
CMOS Chip Planarization by Chemical Mechanical Polishing for a Vertically Stacked Metal MEMS Integration
Document Type
Article
Date of Publication
2004
Publication Title
Journal of Micromechanics and Microengineering
First Page
108
Last Page
115
DOI
https://ui.adsabs.harvard.edu/link_gateway/2004JMiMi..14..108L/doi:10.1088/0960-1317/14/1/015
Recommended Citation
Lee, H.; Miller, M. H.; and Biffano, T. G., "CMOS Chip Planarization by Chemical Mechanical Polishing for a Vertically Stacked Metal MEMS Integration" (2004). Engineering, School of . 307.
https://cufind.campbell.edu/engineering/307
COinS
