Using Vibration Assisted Grinding to Reduce Subsurface Damage

W. Qu, K. Wang, Michele Miller, Y. Huang, A. Chandra

Research output: Contribution to journal › Article › peer-review

Disciplines

@article{07468702deb045c39fa01aa750b9568f,

title = "Using Vibration Assisted Grinding to Reduce Subsurface Damage",

author = "W. Qu and K. Wang and Michele Miller and Y. Huang and A. Chandra",

year = "2000",

month = jan,

day = "1",

doi = "10.1016/S0141-6359(00)00043-X",

language = "American English",

volume = "24",

journal = "Precision Engineering",

}

TY - JOUR

T1 - Using Vibration Assisted Grinding to Reduce Subsurface Damage

AU - Qu, W.

AU - Wang, K.

AU - Miller, Michele

AU - Huang, Y.

AU - Chandra, A.

PY - 2000/1/1

Y1 - 2000/1/1

UR - https://cufind.campbell.edu/engineering/304

UR - https://doi.org/10.1016/S0141-6359(00)00043-X

U2 - 10.1016/S0141-6359(00)00043-X

DO - 10.1016/S0141-6359(00)00043-X

M3 - Article

VL - 24

JO - Precision Engineering

JF - Precision Engineering

ER -