CMOS Chip Planarization by Chemical Mechanical Polishing for a Vertically Stacked Metal MEMS Integration

H. Lee, Michele Miller, T. G. Biffano

Research output: Contribution to journal › Article › peer-review

Original language	American English
Journal	Journal of Micromechanics and Microengineering
Volume	14
DOIs	https://doi.org/10.1088/0960-1317/14/1/015
State	Published - Jan 1 2004

Disciplines

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title = "CMOS Chip Planarization by Chemical Mechanical Polishing for a Vertically Stacked Metal MEMS Integration",

author = "H. Lee and Michele Miller and Biffano, \{T. G.\}",

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AU - Miller, Michele

AU - Biffano, T. G.

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UR - https://cufind.campbell.edu/engineering/307

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