CMOS Chip Planarization by Chemical Mechanical Polishing for a Vertically Stacked Metal MEMS Integration

Research output: Contribution to journal › Article › peer-review

Original language	American English
Journal	Journal of Micromechanics and Microengineering
Volume	14
DOIs	https://doi.org/10.1088/0960-1317/14/1/015
State	Published - Jan 1 2004

Disciplines

@article{ec99ebdf947e44c9a9ba78ecd0ccef2c,

title = "CMOS Chip Planarization by Chemical Mechanical Polishing for a Vertically Stacked Metal MEMS Integration",

author = "H. Lee and Michele Miller and Biffano, \{T. G.\}",

year = "2004",

month = jan,

day = "1",

doi = "10.1088/0960-1317/14/1/015",

language = "American English",

volume = "14",

journal = "Journal of Micromechanics and Microengineering",

}

TY - JOUR

T1 - CMOS Chip Planarization by Chemical Mechanical Polishing for a Vertically Stacked Metal MEMS Integration

AU - Lee, H.

AU - Miller, Michele

AU - Biffano, T. G.

PY - 2004/1/1

Y1 - 2004/1/1

UR - https://cufind.campbell.edu/engineering/307

UR - https://ui.adsabs.harvard.edu/link_gateway/2004JMiMi..14..108L/doi:10.1088/0960-1317/14/1/015

U2 - 10.1088/0960-1317/14/1/015

DO - 10.1088/0960-1317/14/1/015

M3 - Article

VL - 14

JO - Journal of Micromechanics and Microengineering

JF - Journal of Micromechanics and Microengineering

ER -